Penta Alroc MF1+/60 – Multifunction Tool for Bonded Semiconductor
Product overview
Penta Alroc MF1+/60 Tool is a multifunctional solution for removing and shaping bonded semiconductors on medium and high voltage cables. This advanced tool enables the user to shave the bonded semiconductor to a precise length and apply a chamfer on the cutback for a smooth, professional finish. With its adjustable blade and optional stylus, the Alroc MF1+/60 Tool delivers flexible, field-ready performance tailored to both peelable and non-peelable semiconductor applications.
Alroc MF1+/60 – Versatile Bonded Semiconductor Multifunction Tool
Developed for specialists working on power cable terminations, the Alroc Bonded Semiconductor Tool combines precision, adjustability and ergonomic control in one compact unit. The embedded sliding thrust lets users easily set the remaining semiconductor length, while the finely calibrated adjustment dial allows 1/10 mm blade control for clean, damage-free stripping. With certified approval by ENEDIS and compatibility with cables from 18 mm to 60 mm, the MF1+/60 Tool is ideal for various operations including shaving, shaping and chamfering insulation and semiconductors.
Key Features & Benefits
- Designed to shave and chamfer bonded semiconductor cleanly
- Adjustable blade with 1/10 mm “click” precision control
- Optional stylus for scoring peelable semiconductor or chamfering insulation
- Smooth finishing over insulation to maintain cable integrity
- Built-in sliding thrust to preset semiconductor remaining length
- Multifunction tool for sheath removal, shaping, stripping and grounding
- Thickness capacity: 0,4 – 1,4 mm (0,016 – 0,055 in)
- Semiconductor cutback chamfer angle: 14.5°
- Remaining length options: 30, 40, 45, 50, 55 mm (1,181 – 2,165 in)
- Tool capacity range: Diameter 18 – 60 mm (0,709 – 2,362 in)
- Dimensions: Length 305 mm, Width 85 mm, Height 100 mm
- Weight: 1,04 kg – lightweight and easy to handle
- Supplied in a durable box for transport and protection
Penta MF1+/60 Tool – Flexible and Field-Proven Cable Prep
Whether you’re stripping semiconductors, preparing chamfers or managing insulation transitions, the Penta Bonded Semiconductor Tool delivers high-performance functionality in a single, rugged package. This MF1+/60 Bonded Semiconductor Tool is trusted by engineers and cable installers worldwide for its reliability, accuracy and ease of use. From outer sheath to conductor, the Penta MF1+/60 supports a wide range of critical cable preparation tasks.
For Additional Information, please consult the Technical Data Table or PDF File below.
*Technical Data subject to change without notice.
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+44 (0)1744 762 929Technical Data
| Part Number | Diameter (mm) | Diameter (in) | Thickness Capacity (mm) | Thickness Capacity (in) | Angle of the chamfer on the semiconductor | Remaining length of the semiconductor (mm) | Remaining length of the semiconductor (in) | Length (mm) | Length (in) | Width (mm) | Width (in) | Height (mm) | Height (in) | Packaging |
| MF1+/60 | 18 - 60 | 0,709 - 2,362 | 0,4 - 1,4 | 0,016 - 0,055 | 14,5° | 30-40-45-50-55 | 1,181- 1,575- 1,772- 1,969- 2,165 | 305 | 12,008 | 85 | 3,346 | 100 | 3,937 | Box |